DS300 Mass Flow Controller

The DS300 Pressure-based Gas Mass Flow Controller is a gas mass flow controller developed for the semiconductor industry and suitable for semiconductor equipment, used in processes such as etching and sputtering of semiconductor devices. The DS300 adopts pressure-based flow sensor technology and high-precision piezoelectric valve control technology, giving the product features such as low zero drift, high accuracy, fast response speed, and pressure insensitivity. All gas-contacting surfaces of the product are stainless steel metal, and the metal surface condition meets SEMI standard requirements.

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Product Description

Advantages

• High control accuracy, precision up to ±1.0% S.P.(≥10%F.S.).
• Fast response speed, response time ≤ 0.5sec.
• Adopts flow sensor technology based on pressure principle, making the product pressure-insensitive and adaptable to large fluctuations in air source pressure.
• DS300 uses effective mechanical processing and surface treatment technologies to solve the problem of deep small holes that cannot be or are difficult to electropolish (EP), achieving electrochemical polishing treatment of stainless steel small holes, deep blind holes, and cross holes with relatively small aperture (<1mm) and relatively large depth-to-diameter ratio (>10), fully meeting SEMI standard requirements.

Technical Parameters

DS300C
Type	DS300C
Valve Type	Normally Closed
Flow Specification (N2)	(0～30,50,100,200,300,500) SCCM (0～1,2,3,5,10) SLM
Accuracy	±1% S.P. (≥10% F.S.) ±1% F.S. (＜10% F.S.)
Linearity	±0.5% F.S.
Repeatability	±0.2% F.S.
Response Time	≤ 0.5sec
Inlet Pressure	240～450KPa Flow Specification≤5SLM 350～450KPa Flow Specification＞5SLM
Outlet Pressure	≤1.2KPa Flow Specification≤5SLM ≤13.3KPa Flow Specification＞5SLM
Temperature Coefficient	Zero Point: ≤±0.02% F.S./℃； During Adjustment: ≤±0.1% F.S./℃
Withstanding Pressure	3 MPa
Leak Rate	1×10 ^-11 Pa·m ³ / sec He
Sealing Material	Metal Seal
Maximum Operating Pressure	0.45MPa
Operating Ambient Temperature	(10～45)℃
Input Signal	Digital: RS485 or DeviceNet Analog: (0～5)VDC
Output Signal	Digital: RS485 or DeviceNet Analog: (0～5)VDC
Zero Drift	Without Zero Correction: ＜0.6%F.S./year
Power Supply	±8～±16 VDC (Bipolar) or +14～+28 VDC (Unipolar)
Surface Chemical Composition	Cr/Fe Ratio ≥2.0； CrO Thickness ≥20 (Angstrom)
Surface Roughness	Ra 5μinch
Standard Connector Type	VCR1/4 Male Connector； 1.125″C-type Seal Connector； 1.125″W-type Seal Connector； Compression Fittingφ6
Power Connector Type	D-type 9-pin Male Connector； D-type 15-pin Male Connector； DeviceNet Connector
Weight	1.2Kg

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