Sevenstar releases the new generation CS300 MFC for semiconductor marketing. Based on CS technology platform, CS300 is the latest generation designed especially for large scaled IC equipments .CS300 MFC has the DF based pressure compensation algorithm, improved surface finishing and Specification comply with SEMI standard, also 1.125" IGS W -seal and C-seal interface are available.

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　　Features

　　1. High Accuracy and Fast Respond

　　The accuracy of the CS300 MFC has been improved to ±0.8% of S.P., and the most advanced models have a less than 0.5 sec response time.

　　2. Low Zero Drift and Temperature Coefficient

　　The invention of new sensor technology enables the CS230 MFC to maintain stability and withstand temperature fluctuations. Without an auto-zero amplifier, the expected zero drift is less than 0.6%F.S./year, and the temperature coefficient is less than 0.02%F.S./℃(zero)，0.05%F.S./ ℃ (span).

　　3.Metal-Sealed Models and High Purity Feature

　　The special metal surface process is applied in CS300. 316 stainless steel VV is used and rough ness could be less than 5 RA which is required by the semi standards.

　　4. Compatible Interfaces

　　The CS300 MFC is compatible with the following interfaces, which may be selected by the customer:±8V-±16V double-end power supply and +14V-+28V single-end power supply; digital or analog signal input and output; SEMI standard mechanical dimensions; and RS-485 or DeviceNetTM communications module.

　　5. Miscellaneous Functions

　　Powerful customer software comes standard with each model, while additional functions such as multi-gas，multi-range，auto-zero, alarms, soft start, and delay are available as customer selections.

　　6. CS300 MFCs support 1.125", 1.5" W, C IGS.

　　Specification

	CS300
Type	CS310C		CS320C		CS310D			CS320D
Valve Type	Normally Closed or Normally Open	N/A	Normally Closed or Normally Open	N/A	Normally Closed or Normally Open	N/A	Normally Closed or Normally Open		N/A
Full scale range (N₂)	( 0～1,2,3,5,10,20,30,50,100,200,300,500)SCCM				( 0～1,2,3,5,10,20,30,50,100,200,300,500)SCCM
	( 0～1,2,3,5,10,20,30)SLM				( 0～1,2,3,5,10,20,30)SLM
Accuracy	±1.0% S.P. (≥35% F.S.) (±0.80% S.P. (≥30% F.S.) optional)				±1.0% S.P. (≥35% F.S.) (±0.80% S.P. (≥30% F.S.) optional)
	±0.35% F.S. (＜35% F.S.) (±0.24% F.S. (＜30% F.S.) optional)				±0.35% F.S. (＜35% F.S.) (±0.24% F.S. (＜30% F.S.) optional)
Linearity	±0.5% F.S.				±0.5% F.S.
Repeatability	±0.2% F.S.				±0.2% F.S.
Response Time	≤ 0.8 sec (standard)				≤ 0.8 sec (standard)
Differential Pressure	0.05～0.35MPa （Flow≤10slm）	＜0.02 Mpa	0.05～0.35MPa （Flow≤10slm）	＜0.02MPa	0.05～0.35MPa （Flow≤10slm）	＜0.02 Mpa	0.05～0.35MPa （Flow≤10slm）		＜0.02MPa
	0.15～0.35MPa （Flow＞10slm）		0.15～0.35MPa （Flow＞10slm）		0.15～0.35MPa （Flow＞10slm）		0.15～0.35MPa （Flow＞10slm）
Temperature	Zero:≤±0.02% F.S./℃; Span:≤±0.05% F.S./℃				Zero:≤±0.02% F.S./℃; Span:≤±0.05% F.S./℃
Coefficient
Max Pressure	3.5MPa (435pisg)				3.5MPa (435pisg)
Leak integrity	1×10^-11Pa.m³ / sec He				1×10^-11 Pa.m³ / sec He
Seal Materials	Metal				Metal
maximum operating pressure	0.45MPa				0.45MPa
Operation	（0～50）℃				（0～50）℃
Temperature
Input Signal	Digital: RS485 or DeviceNet^TM	N/A	Digital:RS485 or DeviceNet^TM	N/A	Digital: RS485 or DeviceNet^TM	N/A	Digital:RS485 or DeviceNet^TM		N/A
	Analog:(0～5)VDC		Analog:(0～5)VDC		Analog:(0～5)VDC		Analog:(0～5)VDC
Output Signal	Digital: RS485 or DeviceNet^TM				Digital: RS485 or DeviceNet^TM
	Analog:(0～5)VDC				Analog:(0～5)VDC
Zero Drift	＜0.6%F.S. per year without autozero				＜0.6%F.S. per year without autozero
Power Supply	±8 ~ ±16 VDC (bipolar) or +14 ~ +28 VDC (unipolar)				±8 ~ ±16 VDC (bipolar) or +14 ~ +28 VDC (unipolar)
Surface Chemistry	Cr/Fe ratio ＞2.0; CrO thickness ＞20 Angstroms				-
Surface Finish	Ra 5 μ inch				Ra 25 μ inch
Fittings	VCR1/4” M；		1.5″B		VCR 1/4” M；			1.5″B
	1.125″C Type		1.5″C		1.125″C Type			1.5″C
	1.125″W Type		1.5″W		1.125″W Type			1.5″W
Electronic Connector	9 pin male sub-D ，15 pin male sub-D ，DeviceNet^TM male，				9 pin male sub-D ，15 pin male sub-D ，DeviceNet^TM male，
Weight	1kg	0.8kg	1.2kg	1kg	1kg	0.8kg	1.2kg		1kg

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